TECHNOMELT PW819

Application

• Wrapping a core made of chipboard, MDF or solid wood with paper films
• Wrapping a flat profile

Product Properties

• Low viscosity
• Clean application
• High efficiency
• Good wetting of impregnated (impregnated) papers
• Fast-melting, especially recommended for high-speed lines and a profile of complex shape
• High temperature resistance of the finished profile

Technical data

• Softening point (Ring and Ball), °C ~81
• Brookfield viscosity 180 °C, MPa*s ~8,800
• Brookfield viscosity - 200 °C, MPa *s ~ 4,500
• Temperature resistance, °C ~70
• Tested on 0.6 mm oak veneer using the method of temperature increase according to Henkel standards.

Operating temperature

• Recommended operating temperature:on an adhesive roller/nozzle, °C 170-190

Recommended consumption

• Solid, MDF, g/m2 50-100
• Chipboard, g/m2 80-110

Safety precautions
Melt adhesives are prone to vaporization even at operating temperatures. The smell of vapors can cause irritation. Long-term temperature exposure to the melt may cause partial decomposition of the adhesive. Therefore, it is necessary to take measures to ensure the removal of vapors from the working area, for example by installing aspiration equipment.

STORAGE
Store in tightly closed original packaging ina dry and cool place.

Shelf life
Shelf life (in the original packaging), 2 years

The above data, first of all, recommendations regarding the application and use of the product, are based on the knowledge and experience of our company. Taking into account the possibility of using different materials in different working conditions that are outside our sphere of influence, we recommend testing the product in each specific case so that its use makes it possible to use the desired production method and ensures the necessary quality of processing parts. Legal liability cannot be deduced either from these instructions or from oral consultation.